Here's a detailed prompt you can give to Flux:

> Complete the PCB implementation automatically. Place every component inside the board outline with a layout optimized for signal integrity, manufacturability, and ease of debugging. Arrange the STM32H743ZIT6 near the center, place all decoupling capacitors immediately adjacent to their corresponding power pins, keep the HSE and LSE crystal circuits as close to the MCU as possible, position the USB-C connector on a board edge, place the SWD header at an accessible edge, and locate the ESP-12F at the board edge with a proper antenna keep-out area. Position the W25Q128 SPI Flash close to the MCU, place the regulator and power circuitry near the power input, and arrange GPIO, UART, SPI, I²C, CAN, ADC, DAC, PWM, and SDMMC headers around the board edges with clear silkscreen labels.

After component placement, perform complete routing on a 4-layer PCB:

Layer 1: Top signal

Layer 2: Solid ground plane

Layer 3: Power plane

Layer 4: Bottom signal


Follow STMicroelectronics layout guidelines:

Keep power traces short and wide.

Route USB D+ and D− as a matched differential pair.

Minimize crystal trace lengths.

Maintain continuous ground return paths.

Add stitching vias around the board and near high-speed signals.

Use proper via sizes and trace widths based on current requirements.

Separate analog and digital routing where appropriate.

Ensure all decoupling capacitors are correctly connected.


Complete routing for all nets with 100% routing completion. Eliminate all unrouted nets and unintended floating pins. Then run ERC and DRC repeatedly until there are zero critical errors and zero DRC violations. Optimize the layout for manufacturability and prepare the board for fabrication. Do not stop until placement, routing, verification, and manufacturing outputs are complete.