(footprint "XIAO-ESP32-C6-SMD"
	(version 20240108)
	(generator "pcbnew")
	(generator_version "8.0")
	(layer "F.Cu")
	(property "Reference" "REF**"
		(at -9.5 -11.5 0)
		(layer "F.SilkS")
	)
	(property "Value" "XIAO-ESP32-C6-SMD"
		(at 0 9 0)
		(layer "F.Fab")
	)
	(property "Footprint" ""
		(at -9.1166 10.5215 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Datasheet" ""
		(at -9.1166 10.5215 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at -9.1166 10.5215 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(pad "1" smd roundrect
		(at -8.2816 -7.5985)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "2" smd roundrect
		(at -8.2816 -5.0585)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "3" smd roundrect
		(at -8.2816 -2.5185)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "4" smd roundrect
		(at -8.2816 0.0215)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "5" smd roundrect
		(at -8.2816 2.5615)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "6" smd roundrect
		(at -8.2816 5.1015)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "7" smd roundrect
		(at -8.2816 7.6415)
		(size 2.75 2)
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		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "8" smd roundrect
		(at 7.8834 7.6415)
		(size 2.75 2)
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		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "9" smd roundrect
		(at 7.8834 5.1015)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "10" smd roundrect
		(at 7.8834 2.5615)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "11" smd roundrect
		(at 7.8834 0.0215)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "12" smd roundrect
		(at 7.8834 -2.5185)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "13" smd roundrect
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		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "14" smd roundrect
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		(size 2.75 2)
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		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "15" smd roundrect
		(at -2.008 5.5532 270)
		(size 2.5 1.1)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "16" smd roundrect
		(at 0.532 5.5532 270)
		(size 2.5 1.1)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "17" smd circle
		(at -1.5 -8.62)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "18" smd circle
		(at 1.04 -8.62)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "19" smd circle
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		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "20" smd circle
		(at 1.04 -6.08)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "21" smd circle
		(at -1.5 -3.54)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "22" smd circle
		(at 1.04 -3.54)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "23" smd circle
		(at -1.5 -1)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "24" smd circle
		(at 0.9474 -1.0568)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
)
