(footprint "XIAO-ESP32-C3-SMD"
	(version 20240108)
	(generator "pcbnew")
	(generator_version "8.0")
	(layer "F.Cu")
	(property "Reference" "REF**"
		(at -8.835 -10.96 0)
		(layer "F.SilkS")
	)
	(property "Value" "XIAO-ESP32-C3-SMD"
		(at 0.055 9.04 0)
		(layer "F.Fab")
	)
	(property "Footprint" ""
		(at -8.835 10.54 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Datasheet" ""
		(at -8.835 10.54 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at -8.835 10.54 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(pad "1" smd roundrect
		(at -8 -7.58)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "2" smd roundrect
		(at -8 -5.04)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "3" smd roundrect
		(at -8 -2.5)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "4" smd roundrect
		(at -8 0.04)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "5" smd roundrect
		(at -8 2.58)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "6" smd roundrect
		(at -8 5.12)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "7" smd roundrect
		(at -8 7.66)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "8" smd roundrect
		(at 8.165 7.66)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "9" smd roundrect
		(at 8.165 5.12)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "10" smd roundrect
		(at 8.165 2.58)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "11" smd roundrect
		(at 8.165 0.04)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "12" smd roundrect
		(at 8.165 -2.5)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "13" smd roundrect
		(at 8.165 -5.04)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "14" smd roundrect
		(at 8.165 -7.58)
		(size 2.75 2)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "15" smd roundrect
		(at -4.39 -0.342 180)
		(size 2.5 1.1)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "16" smd roundrect
		(at -4.39 -2.247 180)
		(size 2.5 1.1)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
		(solder_mask_margin 0.0508)
		(thermal_bridge_angle 45)
	)
	(pad "17" smd circle
		(at -1.215 -8.592)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "18" smd circle
		(at 1.325 -8.592)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "19" smd circle
		(at -1.215 -6.052)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "20" smd circle
		(at 1.325 -6.052)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "21" smd circle
		(at -1.215 -3.512)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "22" smd circle
		(at 1.325 -3.512)
		(size 1.7 1.7)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
)
