(module XDCR_CMM-4030DT-26354-TR (layer F.Cu) (tedit 66B9DE7F)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -0.075 -3.485 0) (layer F.SilkS))
  (fp_text value XDCR_CMM-4030DT-26354-TR (at 11.89 3.395 0) (layer F.Fab))
  (pad 1 smd rect (at 0.425 0.675) (size 0.45 0.95) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at 0.425 -0.675) (size 0.45 0.95) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd rect (at -0.425 -0.675) (size 0.45 0.95) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd rect (at -0.425 0.675) (size 0.45 0.95) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd rect (at 0.0 1.775) (size 1.3 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd rect (at 1.275 0.0) (size 0.45 2.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd rect (at 0.0 -1.775) (size 1.3 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd rect (at -1.275 0.0) (size 0.45 2.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)