(module XCVR_NRF24L01P-MODULE-PCB (layer F.Cu) (tedit 646EB26C)
  (fp_text reference REF** (at 0 -8.925) (layer F.SilkS))
  (fp_text value XCVR_NRF24L01P-MODULE-PCB (at 0 8.85) (layer F.Fab))
  (pad 1 thru_hole circle (at -15.2844 -5.6689) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask))
  (pad 2 thru_hole circle (at -12.7445 -5.6689) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask))
  (pad 3 thru_hole circle (at -15.2844 -3.1289) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask))
  (pad 4 thru_hole circle (at -12.7445 -3.1289) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask))
  (pad 5 thru_hole circle (at -15.2844 -0.5889) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask))
  (pad 6 thru_hole circle (at -12.7445 -0.5889) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask))
  (pad 7 thru_hole circle (at -15.2844 1.9511) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask))
  (pad 8 thru_hole circle (at -12.7445 1.9511) (size 1.524 1.524) (drill 1.016) (layers *.Cu *.Mask))
)
