(footprint "DIP254P762X533-8" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 638C0FF3)
  (attr through_hole)
  (fp_text reference "REF**" (at -2.97471 -11.84802) (layer "F.SilkS"))
  (fp_text value "DIP254P762X533-8" (at 9.4123 4.044745) (layer "F.Fab"))
  (pad "INC" thru_hole rect (at -7.62 -7.62) (size 1.6764 1.6764) (drill 1.1176) (layers *.Cu *.Mask))
  (pad "RH" thru_hole circle (at -7.62 -2.54) (size 1.6764 1.6764) (drill 1.1176) (layers *.Cu *.Mask))
  (pad "RL" thru_hole circle (at 0 -2.54) (size 1.6764 1.6764) (drill 1.1176) (layers *.Cu *.Mask))
  (pad "RW" thru_hole circle (at 0 0) (size 1.6764 1.6764) (drill 1.1176) (layers *.Cu *.Mask))
  (pad "U/D" thru_hole circle (at -7.62 -5.08) (size 1.6764 1.6764) (drill 1.1176) (layers *.Cu *.Mask))
  (pad "VCC" thru_hole circle (at 0 -7.62) (size 1.6764 1.6764) (drill 1.1176) (layers *.Cu *.Mask))
  (pad "VSS" thru_hole circle (at -7.62 0) (size 1.6764 1.6764) (drill 1.1176) (layers *.Cu *.Mask))
  (pad "~CS" thru_hole circle (at 0 -5.08) (size 1.6764 1.6764) (drill 1.1176) (layers *.Cu *.Mask))
)
