(module Package_CSP:WLCSP-12_1.403x1.555mm_P0.4mm_Stagger (layer F.Cu) (tedit 5C18324B)
  (descr "WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208")
  (tags "CSP 12 0.2x0.346333")
  (solder_mask_margin 0.0325)
  (solder_paste_margin 0.000001)
  (attr smd)
  (fp_text reference REF** (at 0 -1.7775) (layer F.SilkS))
  (fp_text value WLCSP-12_1.403x1.555mm_P0.4mm_Stagger (at 0 1.7775) (layer F.Fab))
  (fp_text user %R (at 0 0) (layer F.Fab))
  (pad D6 smd circle (at 0.5 0.5195) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad D4 smd circle (at 0.1 0.5195) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad D2 smd circle (at -0.3 0.5195) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad C5 smd circle (at 0.3 0.173167) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad C3 smd circle (at -0.1 0.173167) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad C1 smd circle (at -0.5 0.173167) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad B6 smd circle (at 0.5 -0.173167) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad B4 smd circle (at 0.1 -0.173167) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad B2 smd circle (at -0.3 -0.173167) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad A5 smd circle (at 0.3 -0.5195) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad A3 smd circle (at -0.1 -0.5195) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (pad A1 smd circle (at -0.5 -0.5195) (size 0.215 0.215) (layers F.Cu F.Paste F.Mask))
  (model ${KISYS3DMOD}/Package_CSP.3dshapes/WLCSP-12_1.403x1.555mm_P0.4mm_Stagger.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
