(module Package_SO:TSSOP-8_3x3mm_P0.65mm (layer F.Cu) (tedit 65B12406)
  (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)")
  (tags "SSOP 0.65")
  (attr smd)
  (fp_text reference REF** (at 0 -2.55) (layer F.SilkS))
  (pad 8 smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.15 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 2.15 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.15 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.15 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-8_3x3mm_P0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
