(module Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 64098D90)
  (descr "TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
  (tags "TSSOP SO")
  (attr smd)
  (fp_text reference REF** (at 0 -4.2) (layer F.SilkS))
  (fp_text value TSSOP-20_4.4x6.5mm_P0.65mm (at 0 4.2) (layer F.Fab))
  (pad 20 smd roundrect (at 2.8625 -2.925) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 19 smd roundrect (at 2.8625 -2.275) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 18 smd roundrect (at 2.8625 -1.625) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 17 smd roundrect (at 2.8625 -0.975) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 16 smd roundrect (at 2.8625 -0.325) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 15 smd roundrect (at 2.8625 0.325) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 14 smd roundrect (at 2.8625 0.975) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 13 smd roundrect (at 2.8625 1.625) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 12 smd roundrect (at 2.8625 2.275) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 11 smd roundrect (at 2.8625 2.925) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 10 smd roundrect (at -2.8625 2.925) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 9 smd roundrect (at -2.8625 2.275) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 8 smd roundrect (at -2.8625 1.625) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 7 smd roundrect (at -2.8625 0.975) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 6 smd roundrect (at -2.8625 0.325) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -2.8625 -0.325) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -2.8625 -0.975) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 3 smd roundrect (at -2.8625 -1.625) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 2 smd roundrect (at -2.8625 -2.275) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 1 smd roundrect (at -2.8625 -2.925) (size 1.475 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
