(module Package_SO:TI_SO-PowerPAD-8 (layer F.Cu) (tedit 64673423)
  (descr "8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)")
  (tags "SSOP 0.50 exposed pad")
  (attr smd)
  (fp_text reference REF** (at 0 -3.3) (layer F.SilkS))
  (pad 9 smd rect (at 0 0) (size 2.95 3.45) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 8 smd rect (at 2.78 -1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.78 -0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.78 0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 2.78 1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.78 1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.78 0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.78 -0.635) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -2.78 -1.905) (size 1.91 0.61) (layers F.Cu F.Paste F.Mask))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/TI_SO-PowerPAD-8.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
