(module TE_2305018-2 (layer F.Cu) (tedit 66FF5E5B)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -2.7145075 -6.9070985 0) (layer F.SilkS))
  (fp_text value TE_2305018-2 (at 0.133964 -5.906997 0) (layer F.Fab))
  (pad SH1 thru_hole oval (at -4.45 -0.25) (size 0.88 2.08) (drill oval 0.48 1.68) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad SH2 thru_hole oval (at 4.45 -0.25) (size 0.88 2.08) (drill oval 0.48 1.68) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad SH3 thru_hole oval (at -4.45 -3.45) (size 0.88 2.08) (drill oval 0.48 1.68) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad SH4 thru_hole oval (at 4.45 -3.45) (size 0.88 2.08) (drill oval 0.48 1.68) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad G1 smd rect (at -3.55 -3.625) (size 0.3 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad G2 smd rect (at 3.55 -3.625) (size 0.3 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A1 smd rect (at -3.05 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A2 smd rect (at -2.25 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A3 smd rect (at -1.75 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A4 smd rect (at -1.25 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A5 smd rect (at -0.75 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A6 smd rect (at -0.25 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A7 smd rect (at 0.25 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A8 smd rect (at 0.75 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A9 smd rect (at 1.25 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A10 smd rect (at 1.75 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A11 smd rect (at 2.25 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad A12 smd rect (at 3.05 -3.625) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B1 smd rect (at 3.0 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B2 smd rect (at 2.5 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B3 smd rect (at 2.0 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B4 smd rect (at 1.5 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B5 smd rect (at 1.0 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B6 smd rect (at 0.5 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B7 smd rect (at -0.5 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B8 smd rect (at -1.0 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B9 smd rect (at -1.5 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B10 smd rect (at -2.0 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B11 smd rect (at -2.5 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad B12 smd rect (at -3.0 -2.375) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (fp_text user "PCB EDGE" (at 5.25 1.0) (layer F.Fab))
)