(module TEXAS_INSTRUMENTS_SN54HC74-SP_0 (layer F.Cu) (tedit 64E6BD5E)
  (descr TI-CD_SNX4XXXX74X-14)
  (attr smd)
  (fp_text reference REF** (at 0 -6) (layer F.SilkS))
  (fp_text value TEXAS_INSTRUMENTS_SN54HC74-SP_0 (at 0 6.5) (layer F.Fab))
  (pad 1 smd roundrect (at -4.5 -3.81 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 2 smd roundrect (at -4.5 -2.54 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 3 smd roundrect (at -4.5 -1.27 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 4 smd roundrect (at -4.5 0 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 5 smd roundrect (at -4.5 1.27 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 6 smd roundrect (at -4.5 2.54 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 7 smd roundrect (at -4.5 3.81 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 14 smd roundrect (at 4.5 -3.81 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 13 smd roundrect (at 4.5 -2.54 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 12 smd roundrect (at 4.5 -1.27 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 11 smd roundrect (at 4.5 0 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 10 smd roundrect (at 4.5 1.27 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 9 smd roundrect (at 4.5 2.54 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
  (pad 8 smd roundrect (at 4.5 3.81 90) (size 0.6 2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.34)
    (solder_mask_margin 0.102))
)
