(module Package_DFN_QFN:TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm (layer F.Cu) (tedit 5EF42118)
  (descr "TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35), generated with kicad-footprint-generator ipc_noLead_generator.py")
  (tags "TDFN NoLead")
  (attr smd)
  (fp_text reference REF** (at 0 -1.95) (layer F.SilkS))
  (fp_text value TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm (at 0 1.95) (layer F.Fab))
  (fp_text user %R (at 0 0) (layer F.Fab))
  (pad "" smd roundrect (at 0.325 0.35) (size 0.52 0.56) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at 0.325 -0.35) (size 0.52 0.56) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at -0.325 0.35) (size 0.52 0.56) (layers F.Paste) (roundrect_rratio 0.25))
  (pad "" smd roundrect (at -0.325 -0.35) (size 0.52 0.56) (layers F.Paste) (roundrect_rratio 0.25))
  (pad 9 smd rect (at 0 0) (size 1.3 1.4) (layers F.Cu F.Mask))
  (pad 8 smd roundrect (at 1.4625 -0.75) (size 0.775 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 7 smd roundrect (at 1.4625 -0.25) (size 0.775 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 6 smd roundrect (at 1.4625 0.25) (size 0.775 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 5 smd roundrect (at 1.4625 0.75) (size 0.775 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -1.4625 0.75) (size 0.775 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 3 smd roundrect (at -1.4625 0.25) (size 0.775 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 2 smd roundrect (at -1.4625 -0.25) (size 0.775 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 1 smd roundrect (at -1.4625 -0.75) (size 0.775 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
