(footprint SW_SS12D07VG4 (layer F.Cu) (tedit 676C6428)
  (descr "")
  (fp_text reference REF** (at -1.325 -3.635 0) (layer F.SilkS))
  (fp_text value SW_SS12D07VG4 (at 3.755 4.135 0) (layer F.Fab))
  (pad 1 thru_hole rect (at -2.0 0.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2 thru_hole circle (at 0.0 0.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 3 thru_hole circle (at 2.0 0.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S1 thru_hole oval (at -4.2 0.0) (size 1.23 2.46) (drill oval 0.7 1.5) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S2 thru_hole oval (at 4.2 0.0) (size 1.23 2.46) (drill oval 0.7 1.5) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)