(module SW_DS04-254-1L-02BK (layer F.Cu) (tedit 6811D8EB)
  (descr "")
  (fp_text reference REF** (at -0.125 -4.365 0) (layer F.SilkS))
  (fp_text value SW_DS04-254-1L-02BK (at 8.765 4.295 0) (layer F.Fab))
  (pad 1A thru_hole rect (at -3.81 -1.27) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 1B thru_hole circle (at 3.81 -1.27) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2A thru_hole circle (at -3.81 1.27) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2B thru_hole circle (at 3.81 1.27) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)