(module STMicroelectronics-8-Mini_DIP-0-0-0 (layer F.Cu) (tedit 5EF1661C)
(fp_text reference REF** (at -4.6600000000 -6.2850000000 0.0000000000) (layer F.SilkS))
(pad 1 thru_hole rect (at -3.8100000000 -3.8100000000 )(size 1.3000000000 1.3000000000)(drill 0.8)(layers *.Cu)(thermal_width 0.4))
(pad 2 thru_hole circle (at -3.8100000000 -1.2700000000 )(size 1.3000000000 1.3000000000)(drill 0.8)(layers *.Cu)(thermal_width 0.4))
(pad 3 thru_hole circle (at -3.8100000000 1.2700000000 )(size 1.3000000000 1.3000000000)(drill 0.8)(layers *.Cu)(thermal_width 0.4))
(pad 4 thru_hole circle (at -3.8100000000 3.8100000000 )(size 1.3000000000 1.3000000000)(drill 0.8)(layers *.Cu)(thermal_width 0.4))
(pad 5 thru_hole circle (at 3.8100000000 3.8100000000 )(size 1.3000000000 1.3000000000)(drill 0.8)(layers *.Cu)(thermal_width 0.4))
(pad 6 thru_hole circle (at 3.8100000000 1.2700000000 )(size 1.3000000000 1.3000000000)(drill 0.8)(layers *.Cu)(thermal_width 0.4))
(pad 7 thru_hole circle (at 3.8100000000 -1.2700000000 )(size 1.3000000000 1.3000000000)(drill 0.8)(layers *.Cu)(thermal_width 0.4))
(pad 8 thru_hole circle (at 3.8100000000 -3.8100000000 )(size 1.3000000000 1.3000000000)(drill 0.8)(layers *.Cu)(thermal_width 0.4))
(model eec.models/STMicroelectronics_-_TDA2822M.step
      (at (xyz 0.0000000000 0.0000000000 0.0000000000))
      (rotate (xyz 0.0000000000 0.0000000000 0.0000000000))
      (scale (xyz 1 1 1))
    )
)
