(footprint SOT95P280X110-6N (layer F.Cu) (tedit 68D69528)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -0.068 -2.2064 0) (layer F.SilkS))
  (fp_text value SOT95P280X110-6N (at 4.4024 2.2064 0) (layer F.Fab))
  (pad 1 smd roundrect (roundrect_rratio 0.125) (at -1.155 -0.95) (size 1.45 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd roundrect (roundrect_rratio 0.125) (at -1.155 0.0) (size 1.45 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd roundrect (roundrect_rratio 0.125) (at -1.155 0.95) (size 1.45 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd roundrect (roundrect_rratio 0.125) (at 1.155 0.95) (size 1.45 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd roundrect (roundrect_rratio 0.125) (at 1.155 0.0) (size 1.45 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd roundrect (roundrect_rratio 0.125) (at 1.155 -0.95) (size 1.45 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)