(module SON50P300X200X60-9N (layer F.Cu) (tedit 66EB0719)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0.240175 -1.809295 0) (layer F.SilkS))
  (fp_text value SON50P300X200X60-9N (at 7.354825 1.792685 0) (layer F.Fab))
  (pad 1 smd rect (at -1.42 -0.75) (size 0.89 0.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at -1.42 -0.25) (size 0.89 0.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd rect (at -1.42 0.25) (size 0.89 0.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd rect (at -1.42 0.75) (size 0.89 0.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd rect (at 1.42 0.75) (size 0.89 0.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd rect (at 1.42 0.25) (size 0.89 0.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd rect (at 1.42 -0.25) (size 0.89 0.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd rect (at 1.42 -0.75) (size 0.89 0.3) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 9 smd rect (at 0.0 0.0) (size 0.2 1.6) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)