(module "SON50P300X200X100-9N-D" (layer F.Cu)
  (descr "DFN2x3(MC)")
  (tags "Integrated Circuit")
  (attr smd)
  (fp_text reference IC** (at 0 0) (layer F.SilkS))
  (fp_text user %R (at 0 0) (layer F.Fab))
  (fp_text value "SON50P300X200X100-9N-D" (at 0 0) (layer F.SilkS) hide)
  (pad 1 smd rect (at -1.5 -0.75 90) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.5 -0.25 90) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.5 0.25 90) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -1.5 0.75 90) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 1.5 0.75 90) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 1.5 0.25 90) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 1.5 -0.25 90) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 1.5 -0.75 90) (size 0.3 0.8) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0 0 90) (size 1.55 1.75) (layers F.Cu F.Paste F.Mask))
  (model MCP73832T-2ACI_MC.stp
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
