(module "SON110P970X1010X230-18N" (layer F.Cu)
  (descr "TESEO-LIV3F")
  (tags "Integrated Circuit")
  (attr smd)
  (fp_text reference IC** (at 0 0) (layer F.SilkS))
  (fp_text user %R (at 0 0) (layer F.Fab))
  (fp_text value "SON110P970X1010X230-18N" (at 0 0) (layer F.SilkS) hide)
  (pad 1 smd rect (at -4.5 -4.4 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -4.5 -3.3 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -4.5 -2.2 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -4.5 -1.1 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -4.5 0 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -4.5 1.1 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -4.5 2.2 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -4.5 3.3 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -4.5 4.4 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 4.5 4.4 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 4.5 3.3 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 4.5 2.2 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 4.5 1.1 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 4.5 0 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 4.5 -1.1 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 4.5 -2.2 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 4.5 -3.3 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 4.5 -4.4 90) (size 0.85 1.45) (layers F.Cu F.Paste F.Mask))
  (model TESEO-LIV3F.stp
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
