(module SON100P300X300X80-7N (layer F.Cu) (tedit 67C55B94)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0.465 -2.562 0) (layer F.SilkS))
  (fp_text value SON100P300X300X80-7N (at 9.99 2.562 0) (layer F.Fab))
  (pad 1 smd roundrect (roundrect_rratio 0.125) (at -1.435 -1.0) (size 0.86 0.42) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd roundrect (roundrect_rratio 0.125) (at -1.435 0.0) (size 0.86 0.42) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd roundrect (roundrect_rratio 0.125) (at -1.435 1.0) (size 0.86 0.42) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd roundrect (roundrect_rratio 0.125) (at 1.435 1.0) (size 0.86 0.42) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd roundrect (roundrect_rratio 0.125) (at 1.435 0.0) (size 0.86 0.42) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd roundrect (roundrect_rratio 0.125) (at 1.435 -1.0) (size 0.86 0.42) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd rect (at 0.0 0.0) (size 1.5 2.4) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
)