(module SOIC127P600X175-14N (layer F.Cu) (tedit 65B28AF1)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0.94166 6.38801 0) (layer F.SilkS))
  (fp_text value SOIC127P600X175-14N (at 16.348425 -8.466615 0) (layer F.Fab))
  (pad 1 smd rect (at -2.4638 -3.81) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at -2.4638 -2.54) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd rect (at -2.4638 -1.27) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd rect (at -2.4638 0.0) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd rect (at -2.4638 1.27) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd rect (at -2.4638 2.54) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd rect (at -2.4638 3.81) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd rect (at 2.4638 3.81) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 9 smd rect (at 2.4638 2.54) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 10 smd rect (at 2.4638 1.27) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 11 smd rect (at 2.4638 0.0) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 12 smd rect (at 2.4638 -1.27) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 13 smd rect (at 2.4638 -2.54) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 14 smd rect (at 2.4638 -3.81) (size 1.9812 0.5588) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)