(module SOIC127P600X170-9N (layer F.Cu)
  (descr "SOIC,1.27mm pitch;8 pin,4.00mm W X 5.00mm L X 1.70mm H body (w/thermal tab)")
  (tags "CMS XXX")
  (attr smd)
  (fp_text reference REF** (at 0 0) (layer F.SilkS))
  (fp_text value "" (at 0 0) (layer F.SilkS))
  (pad 1 smd rect (at -2.69748 -1.905) (size 1.5494 0.59944) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.69748 -0.635) (size 1.5494 0.59944) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.69748 0.635) (size 1.5494 0.59944) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.69748 1.905) (size 1.5494 0.59944) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 2.69748 1.905) (size 1.5494 0.59944) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.69748 0.635) (size 1.5494 0.59944) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.69748 -0.635) (size 1.5494 0.59944) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.69748 -1.905) (size 1.5494 0.59944) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0 0) (size 2.44856 3.1496) (layers F.Cu F.Paste F.Mask))
)
