(module Package_SO:SOIC-8_5.23x5.23mm_P1.27mm (layer F.Cu) (tedit 6386B82E)
  (descr "SOIC, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf#page=68), generated with kicad-footprint-generator ipc_gullwing_generator.py")
  (tags "SOIC SO")
  (attr smd)
  (fp_text reference REF** (at 0 -3.56) (layer F.SilkS))
  (fp_text value SOIC-8_5.23x5.23mm_P1.27mm (at 0 3.56) (layer F.Fab))
  (pad 8 smd roundrect (at 3.6 -1.905) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 7 smd roundrect (at 3.6 -0.635) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 6 smd roundrect (at 3.6 0.635) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 5 smd roundrect (at 3.6 1.905) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -3.6 1.905) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 3 smd roundrect (at -3.6 0.635) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 2 smd roundrect (at -3.6 -0.635) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 1 smd roundrect (at -3.6 -1.905) (size 1.6 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_5.23x5.23mm_P1.27mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
