(module SAMTEC_UMPT-09-01-L-RA-WT-M-TR (layer F.Cu) (tedit 695262C0)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -10.825 -10.635 0) (layer F.SilkS))
  (fp_text value SAMTEC_UMPT-09-01-L-RA-WT-M-TR (at 5.05 -9.135 0) (layer F.Fab))
  (pad S1 thru_hole circle (at -12.775 -1.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S2 thru_hole circle (at -12.775 1.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S3 thru_hole circle (at 12.775 -1.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S4 thru_hole circle (at 12.775 1.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 01 smd rect (at -8.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (pad 02 smd rect (at -6.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (pad 03 smd rect (at -4.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (pad 04 smd rect (at -2.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (pad 05 smd rect (at 0.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (pad 06 smd rect (at 2.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (pad 07 smd rect (at 4.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (pad 08 smd rect (at 6.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (pad 09 smd rect (at 8.0 -5.75) (size 1.25 3.5) (layers F.Cu F.Paste))
  (fp_text user "FRONT EDGE OF PCB" (at -12.5 4.0) (layer F.Fab))
)