(module SAMTEC_CJT-T-P-XX-RA-BH1 (layer F.Cu) (tedit 65B74DA6)
  (descr "")
  (fp_text reference REF** (at -0.63 3.961 0) (layer F.SilkS))
  (fp_text value SAMTEC_CJT-T-P-XX-RA-BH1 (at 11.435 5.569 0) (layer F.Fab))
  (pad 4 thru_hole circle (at -1.27 -1.27) (size 1.348 1.348) (drill 0.84) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 5 thru_hole circle (at 1.27 -1.27) (size 1.348 1.348) (drill 0.84) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 6 thru_hole circle (at 1.27 1.27) (size 1.348 1.348) (drill 0.84) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 3 thru_hole circle (at -1.27 1.27) (size 1.348 1.348) (drill 0.84) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 1 thru_hole circle (at -0.635 0.0) (size 0.96 0.96) (drill 0.64) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2 thru_hole circle (at 0.635 0.0) (size 0.96 0.96) (drill 0.64) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (fp_text user "PCB EDGE" (at 5.84 -3.21) (layer F.Fab))
)