(footprint QFN50P250X250X100-12N (layer F.Cu) (tedit 6642B8FA)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 1.02195 -3.52405 0) (layer F.SilkS))
  (fp_text value QFN50P250X250X100-12N (at 11.228415 3.516725 0) (layer F.Fab))
  (pad 5 smd roundrect (roundrect_rratio 0.03) (at -0.25 1.185 90.0) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd roundrect (roundrect_rratio 0.03) (at 0.25 1.185 90.0) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 11 smd roundrect (roundrect_rratio 0.03) (at 0.25 -1.185 90.0) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 12 smd roundrect (roundrect_rratio 0.03) (at -0.25 -1.185 90.0) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 1 smd roundrect (roundrect_rratio 0.03) (at -1.185 -0.75) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd roundrect (roundrect_rratio 0.03) (at -1.185 -0.25) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd roundrect (roundrect_rratio 0.03) (at -1.185 0.25) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd roundrect (roundrect_rratio 0.03) (at -1.185 0.75) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd roundrect (roundrect_rratio 0.03) (at 1.185 0.75) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd roundrect (roundrect_rratio 0.03) (at 1.185 0.25) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 9 smd roundrect (roundrect_rratio 0.03) (at 1.185 -0.25) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 10 smd roundrect (roundrect_rratio 0.03) (at 1.185 -0.75) (size 0.86 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)