(footprint QFN200P2000X2000X160-33T1016N (layer F.Cu) (tedit 647CAC2C)
  (descr "32-QFN, 2.00 mm pitch, 20.00 X 20.00 X 1.60 mm body, 10.16 X 10.16 mm thermal pad<p>32-pin QFN package with 2.00 mm pitch with body size 20.00 X 20.00 X 1.60 mm and thermal pad size 10.16 X 10.16 mm</p>")
  (attr smd)
  (fp_text reference REF** (at 0.0 -11.6259 0) (layer F.SilkS))
  (fp_text value QFN200P2000X2000X160-33T1016N (at 0.0 11.6259 0) (layer F.Fab))
  (pad 1 smd oval (at -9.65 -7.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 2 smd oval (at -9.65 -5.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 3 smd oval (at -9.65 -3.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 4 smd oval (at -9.65 -1.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 5 smd oval (at -9.65 1.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 6 smd oval (at -9.65 3.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 7 smd oval (at -9.65 5.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 8 smd oval (at -9.65 7.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 9 smd oval (at -7.0 9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 10 smd oval (at -5.0 9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 11 smd oval (at -3.0 9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 12 smd oval (at -1.0 9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 13 smd oval (at 1.0 9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 14 smd oval (at 3.0 9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 15 smd oval (at 5.0 9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 16 smd oval (at 7.0 9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 17 smd oval (at 9.65 7.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 18 smd oval (at 9.65 5.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 19 smd oval (at 9.65 3.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 20 smd oval (at 9.65 1.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 21 smd oval (at 9.65 -1.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 22 smd oval (at 9.65 -3.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 23 smd oval (at 9.65 -5.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 24 smd oval (at 9.65 -7.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 25 smd oval (at 7.0 -9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 26 smd oval (at 5.0 -9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 27 smd oval (at 3.0 -9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 28 smd oval (at 1.0 -9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 29 smd oval (at -1.0 -9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 30 smd oval (at -3.0 -9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 31 smd oval (at -5.0 -9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 32 smd oval (at -7.0 -9.65 90.0) (size 1.4118 1.0318) (layers F.Cu F.Mask F.Paste))
  (pad 33 smd rect (at 0.0 0.0) (size 10.16 10.16) (layers F.Cu F.Mask))
)