(module Microchip_Technology-C04-029-0-C-MFG (layer F.Cu) (tedit 63249028)
(fp_text reference REF** (at -2.6800000000 -3.0050000000 0.0000000000) (layer F.SilkS))
(pad 2 smd custom (at -0.2082500000 0.0000000000 )(size 0.5000000000 0.5000000000)(primitives (gr_poly (pts (xy -0.2417500000 2.3000000000) (xy 0.6582500000 2.3000000000) (xy 0.6582500000 0.8250000000) (xy 1.0747500000 0.8250000000) (xy 1.0747500000 -2.3000000000) (xy -0.6582500000 -2.3000000000) (xy -0.6582500000 0.8250000000) (xy -0.2417500000 0.8250000000) (xy -0.2417500000 2.3000000000)) (width 0.0000000000)))(layers F.Mask F.Paste F.Cu))
(pad 1 smd rect (at -1.5000000000 1.6500000000 )(size 0.9000000000 1.3000000000)(layers F.Mask F.Paste F.Cu))
(pad 3 smd rect (at 1.5000000000 1.6500000000 )(size 0.9000000000 1.3000000000)(layers F.Mask F.Paste F.Cu))
(model eec.models/Microchip_Technology_-_DN3135N8-G.step
      (at (xyz 0.0000000000 0.0000000000 0.0000000000))
      (rotate (xyz 0.0000000000 0.0000000000 0.0000000000))
      (scale (xyz 1 1 1))
    )
)
