(footprint MSOP-10_MSE (layer F.Cu) (tedit 68D6973F)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -1.8829 -2.04046 0) (layer F.SilkS))
  (fp_text value MSOP-10_MSE (at -0.6829 2.04046 0) (layer F.Fab))
  (pad 1 smd rect (at -2.1844 -1.00076) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at -2.1844 -0.500381) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd rect (at -2.1844 0.0) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd rect (at -2.1844 0.500381) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd rect (at -2.1844 1.00076) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd rect (at 2.1844 1.00076) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd rect (at 2.1844 0.500381) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd rect (at 2.1844 0.0) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 9 smd rect (at 2.1844 -0.500381) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 10 smd rect (at 2.1844 -1.00076) (size 1.397 0.2794) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 11 smd rect (at 0.0 0.0) (size 1.9304 2.159) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
)