(module MSOP-10_3x3mm_P0.5mm (layer F.Cu) (tedit 5A02F25C)
  (descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SSOP 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 -2.6) (layer F.SilkS))
  (pad 1 smd rect (at -2.2 -1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.2 -0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.2 0) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.2 0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.2 1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.2 1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.2 0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.2 0) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 2.2 -0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 2.2 -1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-10_3x3mm_P0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
