(footprint "MOUDLE23P-SMD-2.54-21X17.8MM.kicad_mod.kicad_sym" (version 20240108) (generator "pcbnew") (generator_version "8.0")
  (layer "F.Cu")
  (property "Reference" "U2" (at 0 -0.9525 0)(unlocked yes)
 (layer "F.SilkS")
  )
  (property "Value" "XIAO-HALF-HOLE-23P" (at 0 0 0)(unlocked yes)
 (layer "F.SilkS")
  )
  (property "Footprint" "MOUDLE23P-SMD-2.54-21X17.8MM.kicad_mod.kicad_sym" (at -2.5 11 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "Datasheet" "" (at 0 0 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "Description" "XIAO-HALF-HOLE-23P" (at -9 15.5 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "Manufacturer" "" (at 0 0 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "MPN" "" (at 0 0 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "SKU" "XIAO-HALF-HOLE-23P" (at 7.5 14.5 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "Part Type" "" (at 0 0 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "Rating" "" (at 0 0 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "Status" "" (at 0 0 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "Temperature" "" (at 0 0 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (property "Priority" "" (at 0 0 0)(unlocked yes)
 (layer "F.Fab")(hide yes)
  )
  (attr smd)
  (net_tie_pad_groups "1" "2" "3" "4" "5" "6" "7" "8" "9" "10" "11" "12" "13" "14" "15" "16" "17" "18" "19" "20" "21" "22" "23")
  (pad "1" thru_hole circle (at 7.62 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "1" thru_hole circle (at 7.62 -7.62 270) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "2" thru_hole circle (at 5.08 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "2" thru_hole circle (at 5.08 -7.62 270) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "3" thru_hole circle (at 2.54 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "3" thru_hole circle (at 2.54 -7.62 270) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "4" thru_hole circle (at 0 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "4" thru_hole circle (at 0 -7.62 270) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "5" thru_hole circle (at -2.54 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "5" thru_hole circle (at -2.54 -7.62 270) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "6" thru_hole circle (at -5.08 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "6" thru_hole circle (at -5.08 -7.62 270) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "7" thru_hole circle (at -7.62 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "7" thru_hole circle (at -7.62 -7.62 270) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "8" thru_hole circle (at -7.62 7.62 90) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "8" thru_hole circle (at -7.62 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "9" thru_hole circle (at -5.08 7.62 90) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "9" thru_hole circle (at -5.08 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "10" thru_hole circle (at -2.54 7.62 90) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "10" thru_hole circle (at -2.54 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "11" thru_hole circle (at 0 7.62 90) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "11" thru_hole circle (at 0 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "12" thru_hole circle (at 2.54 7.62 90) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "12" thru_hole circle (at 2.54 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "13" thru_hole circle (at 5.08 7.62 90) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "13" thru_hole circle (at 5.08 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "14" thru_hole circle (at 7.62 7.62 90) (size 1.4 1.4) (drill 0.85) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "14" thru_hole circle (at 7.62 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "15" thru_hole circle (at 6.35 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "16" thru_hole circle (at 3.81 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "17" thru_hole circle (at 1.27 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "18" thru_hole circle (at -1.27 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "19" thru_hole circle (at -3.81 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "20" thru_hole circle (at -6.35 -8.89 180) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "21" thru_hole circle (at -6.35 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "22" thru_hole circle (at -3.81 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (pad "23" thru_hole circle (at -1.27 8.89) (size 0.9 0.9) (drill 0.6) (layers "*.Cu" "*.Mask")(remove_unused_layers no)
    (solder_mask_margin 0.0381) (thermal_bridge_angle 0)
  )
  (model "${AMZPATH}/3dmodels/AMz3D.3dshapes/XIAO-nRF52840 v15.step"
  (hide yes)
    (offset (xyz -1.778 -6.096 0.381))
    (scale (xyz 1 1 1))
    (rotate (xyz -90 0 0))
  )
  (model "${AMZPATH}/3dmodels/AMz3D.3dshapes/Seeeduino XIAO SAMD21 v4.step"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
  (model "${AMZPATH}/3dmodels/AMz3D.3dshapes/Seeed Studio XIAO RP2040 v26.step"
  (hide yes)
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 90))
  )
  (model "${AMZPATH}/3dmodels/AMz3D.3dshapes/Seeed Studio XIAO-ESP32-C3.step"
  (hide yes)
    (offset (xyz -1.7018 -6.096 0))
    (scale (xyz 1 1 1))
    (rotate (xyz -90 0 0))
  )
  (model "${AMZPATH}/3dmodels/AMz3D.3dshapes/XIAO-ESP32S3 v2.step"
  (hide yes)
    (offset (xyz -1.778 -6.1722 0))
    (scale (xyz 1 1 1))
    (rotate (xyz -90 0 0))
  )
)
