(module MOLEX_1051330011 (layer F.Cu) (tedit 66EA3DCF)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 2.7975 -3.3175 0) (layer F.SilkS))
  (fp_text value MOLEX_1051330011 (at 9.7825 -4.7575 0) (layer F.Fab))
  (pad SH1 thru_hole oval (at -2.8 -1.075) (size 1.8 1.1) (drill oval 1.2 0.5) (layers *.Cu *.Mask) (solder_mask_margin 0.0762))
  (pad SH3 thru_hole oval (at 2.8 -1.075) (size 1.8 1.1) (drill oval 1.2 0.5) (layers *.Cu *.Mask) (solder_mask_margin 0.0762))
  (pad SH2 thru_hole oval (at 0.0 1.075) (size 2.2 1.1) (drill oval 1.6 0.5) (layers *.Cu *.Mask) (solder_mask_margin 0.0762))
  (pad 3 smd rect (at 0.0 -0.825) (size 0.448 1.5) (layers F.Cu F.Paste))
  (pad 2 smd rect (at -0.65 -0.825) (size 0.448 1.5) (layers F.Cu F.Paste))
  (pad 4 smd rect (at 0.65 -0.825) (size 0.448 1.5) (layers F.Cu F.Paste))
  (pad 1 smd rect (at -1.3 -0.825) (size 0.448 1.5) (layers F.Cu F.Paste))
  (pad 5 smd rect (at 1.3 -0.825) (size 0.448 1.5) (layers F.Cu F.Paste))
  (fp_text user "PTH Slot 1.2 +/-0.05 X 0.5 +/-0.05" (at -4.1275 3.2625) (layer Dwgs.User))
  (fp_text user "PTH Slot 1.6 +/-0.05 X 0.5 +/-0.05" (at -4.1275 3.8975) (layer Dwgs.User))
)