(module JST_BM03B-ACHSS-GAN-TF_LF__SN_ (layer F.Cu) (tedit 66B22FDE)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0 -4.185 0) (layer F.SilkS))
  (pad 1 smd rect (at -1.2 -1.875) (size 0.6 0.85) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at 0.0 -1.875) (size 0.6 0.85) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd rect (at 1.2 -1.875) (size 0.6 0.85) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad S2 smd rect (at 2.35 1.9) (size 0.7 0.8) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad S1 smd rect (at -2.35 1.9) (size 0.7 0.8) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)