(module InvenSense_QFN-24_4x4mm_P0.5mm (layer F.Cu) (tedit 5B5A6D8E)
  (descr "24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)")
  (tags "QFN 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 -3.375) (layer F.SilkS))
  (fp_text value InvenSense_QFN-24_4x4mm_P0.5mm (at 0 3.375) (layer F.Fab))
  (fp_text user %R (at 0 0) (layer F.Fab))
  (fp_text user KEEPOUT (at 0 -0.5) (layer Cmts.User))
  (fp_text user "No Copper" (at 0 -0.1) (layer Cmts.User))
  (fp_text user "Directly Below" (at 0 0.25) (layer Cmts.User))
  (fp_text user Component (at 0 0.55) (layer Cmts.User))
  (pad 1 smd rect (at -1.95 -1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.95 -0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.95 -0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -1.95 0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -1.95 0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -1.95 1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -1.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -0.75 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -0.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 0.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 0.75 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 1.25 1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 1.95 1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 1.95 0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 1.95 0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 1.95 -0.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 1.95 -0.75) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 1.95 -1.25) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at 1.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at 0.75 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 21 smd rect (at 0.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 22 smd rect (at -0.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 23 smd rect (at -0.75 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 24 smd rect (at -1.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
  (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.6mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
