(footprint IND_ETQP4M150KFN (layer F.Cu) (tedit 687F390F)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -1.918 -4.1564 0) (layer F.SilkS))
  (fp_text value IND_ETQP4M150KFN (at 2.5524 4.1564 0) (layer F.Fab))
  (pad 1 smd rect (at -2.35 0.0) (size 2.7 2.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at 2.35 0.0) (size 2.7 2.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (zone (net 0) (net_name "") (layer F.Cu) (hatch full 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.01)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -3.7 -3.5)
        (xy -3.7 -1.1)
        (xy -1.0 -1.1)
        (xy -1.0 1.1)
        (xy -3.7 1.1)
        (xy -3.7 3.5)
        (xy 3.7 3.5)
        (xy 3.7 1.1)
        (xy 1.0 1.1)
        (xy 1.0 -1.1)
        (xy 3.7 -1.1)
        (xy 3.7 -3.5)
      )
    )
  )
  (zone (net 0) (net_name "") (layers *.Cu) (hatch full 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.01)
    (keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -3.7 -3.5)
        (xy -3.7 -1.1)
        (xy -1.0 -1.1)
        (xy -1.0 1.1)
        (xy -3.7 1.1)
        (xy -3.7 3.5)
        (xy 3.7 3.5)
        (xy 3.7 1.1)
        (xy 1.0 1.1)
        (xy 1.0 -1.1)
        (xy 3.7 -1.1)
        (xy 3.7 -3.5)
      )
    )
  )
)