(module IC_DRV8848PWPR (layer F.Cu) (tedit 66C1280D)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -1.28 -3.485 0) (layer F.SilkS))
  (fp_text value IC_DRV8848PWPR (at 3.292 3.385 0) (layer F.Fab))
  (pad 1 smd roundrect (roundrect_rratio 0.125) (at -2.9 -2.275) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd roundrect (roundrect_rratio 0.125) (at -2.9 -1.625) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd roundrect (roundrect_rratio 0.125) (at -2.9 -0.975) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd roundrect (roundrect_rratio 0.125) (at -2.9 -0.325) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd roundrect (roundrect_rratio 0.125) (at -2.9 0.325) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd roundrect (roundrect_rratio 0.125) (at -2.9 0.975) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd roundrect (roundrect_rratio 0.125) (at -2.9 1.625) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd roundrect (roundrect_rratio 0.125) (at -2.9 2.275) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 9 smd roundrect (roundrect_rratio 0.125) (at 2.9 2.275) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 10 smd roundrect (roundrect_rratio 0.125) (at 2.9 1.625) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 11 smd roundrect (roundrect_rratio 0.125) (at 2.9 0.975) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 12 smd roundrect (roundrect_rratio 0.125) (at 2.9 0.325) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 13 smd roundrect (roundrect_rratio 0.125) (at 2.9 -0.325) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 14 smd roundrect (roundrect_rratio 0.125) (at 2.9 -0.975) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 15 smd roundrect (roundrect_rratio 0.125) (at 2.9 -1.625) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 16 smd roundrect (roundrect_rratio 0.125) (at 2.9 -2.275) (size 1.5 0.45) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 17 smd rect (at 0.0 0.0) (size 3.4 5.0) (layers F.Cu))
  (pad 18 thru_hole circle (at -1.0 -1.8) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 19 thru_hole circle (at 0.0 -1.8) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 20 thru_hole circle (at 1.0 -1.8) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 21 thru_hole circle (at -1.0 -0.6) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 22 thru_hole circle (at 0.0 -0.6) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 23 thru_hole circle (at 1.0 -0.6) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 24 thru_hole circle (at -1.0 0.6) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 25 thru_hole circle (at 0.0 0.6) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 26 thru_hole circle (at 1.0 0.6) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 27 thru_hole circle (at -1.0 1.8) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 28 thru_hole circle (at 0.0 1.8) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
  (pad 29 thru_hole circle (at 1.0 1.8) (size 0.3 0.3) (drill 0.2) (layers *.Cu))
)