(module HRS_DM3AT-SF-PEJM5 (layer F.Cu) (tedit 64FE7C40)
  (descr "Micro SD card holder with push-to-eject feature.")
  (attr smd)
  (fp_text reference REF** (at -3.98677 -2.43602 0) (layer F.SilkS))
  (fp_text value HRS_DM3AT-SF-PEJM5 (at 5.55359 22.58781 0) (layer F.Fab))
  (pad 1 smd rect (at 3.2 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at 2.1 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd rect (at 1.0 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd rect (at -0.1 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd rect (at -1.2 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd rect (at -2.3 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd rect (at -3.4 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd rect (at -4.5 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad SWB smd rect (at -5.45 0.0) (size 0.7 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad P4 smd rect (at 4.75 0.0) (size 1.0 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad P1 smd rect (at -6.4 4.3) (size 1.0 1.2) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad SWA smd rect (at -6.4 10.5) (size 1.0 0.8) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad P2 smd rect (at -6.4 14.65) (size 1.0 2.8) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad P3 smd rect (at 7.1 15.1) (size 1.3 1.9) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (fp_text user "PCB Edge" (at -4.75766 15.525) (layer F.Fab))
)