(module HRO_TYPE-C-31-M-12 (layer F.Cu) (tedit 6511B1D2)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -1.85 -7.205 0) (layer F.SilkS))
  (fp_text value HRO_TYPE-C-31-M-12 (at 6.405 3.685 0) (layer F.Fab))
  (pad A1_B12 smd rect (at -3.2 -4.75) (size 0.6 1.14) (layers F.Cu F.Paste))
  (pad A4_B9 smd rect (at -2.4 -4.75) (size 0.6 1.14) (layers F.Cu F.Paste))
  (pad A6 smd rect (at -0.25 -4.75) (size 0.3 1.14) (layers F.Cu F.Paste))
  (pad B7 smd rect (at -0.75 -4.75) (size 0.3 1.14) (layers F.Cu F.Paste))
  (pad A5 smd rect (at -1.25 -4.75) (size 0.3 1.14) (layers F.Cu F.Paste))
  (pad B8 smd rect (at -1.75 -4.75) (size 0.3 1.14) (layers F.Cu F.Paste))
  (pad A7 smd rect (at 0.25 -4.75) (size 0.3 1.14) (layers F.Cu F.Paste))
  (pad B6 smd rect (at 0.75 -4.75) (size 0.3 1.14) (layers F.Cu F.Paste))
  (pad A8 smd rect (at 1.25 -4.75) (size 0.3 1.14) (layers F.Cu F.Paste))
  (pad B5 smd rect (at 1.75 -4.75) (size 0.3 1.14) (layers F.Cu F.Paste))
  (pad B4_A9 smd rect (at 2.4 -4.75) (size 0.6 1.14) (layers F.Cu F.Paste))
  (pad B1_A12 smd rect (at 3.2 -4.75) (size 0.6 1.14) (layers F.Cu F.Paste))
  (pad None np_thru_hole circle (at -2.89 -3.68) (size 0.6 0.6) (drill 0.6) (layers *.Cu *.Mask))
  (pad None np_thru_hole circle (at 2.89 -3.68) (size 0.6 0.6) (drill 0.6) (layers *.Cu *.Mask))
  (pad S1 thru_hole oval (at -4.325 -4.17) (size 0.9 2.0) (drill oval 0.6 1.7) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S2 thru_hole oval (at 4.325 -4.17) (size 0.9 2.0) (drill oval 0.6 1.7) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S3 thru_hole oval (at -4.325 0.0) (size 0.9 1.7) (drill oval 0.6 1.4) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S4 thru_hole oval (at 4.325 0.0) (size 0.9 1.7) (drill oval 0.6 1.4) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (fp_text user "PCB EDGE" (at 5.2 1.9) (layer F.Fab))
)