(module HIROSE_CX90BW-16P1 (layer F.Cu) (tedit 682A968B)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -2.075 -6.385 0) (layer F.SilkS))
  (fp_text value HIROSE_CX90BW-16P1 (at 6.18 -4.885 0) (layer F.Fab))
  (pad A1_B12 smd rect (at -2.575 -2.925) (size 0.45 0.95) (layers F.Cu F.Paste))
  (pad MID1 smd rect (at -3.375 -2.925) (size 0.75 0.95) (layers F.Cu F.Paste))
  (pad A4_B9 smd rect (at -1.925 -2.925) (size 0.45 0.95) (layers F.Cu F.Paste))
  (pad A5 smd rect (at -1.4 -2.925) (size 0.2 0.95) (layers F.Cu F.Paste))
  (pad B8 smd rect (at -1.0 -2.925) (size 0.2 0.95) (layers F.Cu F.Paste))
  (pad A6 smd rect (at -0.6 -2.925) (size 0.2 0.95) (layers F.Cu F.Paste))
  (pad B7 smd rect (at -0.2 -2.925) (size 0.2 0.95) (layers F.Cu F.Paste))
  (pad A12_B1 smd rect (at 2.575 -2.925) (size 0.45 0.95) (layers F.Cu F.Paste))
  (pad MID2 smd rect (at 3.375 -2.925) (size 0.75 0.95) (layers F.Cu F.Paste))
  (pad A9_B4 smd rect (at 1.925 -2.925) (size 0.45 0.95) (layers F.Cu F.Paste))
  (pad B5 smd rect (at 1.4 -2.925) (size 0.2 0.95) (layers F.Cu F.Paste))
  (pad A8 smd rect (at 1.0 -2.925) (size 0.2 0.95) (layers F.Cu F.Paste))
  (pad B6 smd rect (at 0.6 -2.925) (size 0.2 0.95) (layers F.Cu F.Paste))
  (pad A7 smd rect (at 0.2 -2.925) (size 0.2 0.95) (layers F.Cu F.Paste))
  (pad SH1 thru_hole oval (at -4.75 0.0) (size 1.15 3.35) (drill oval 0.55 2.75) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad SH2 thru_hole oval (at 4.75 0.0) (size 1.15 3.35) (drill oval 0.55 2.75) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (fp_text user "PCB EDGE" (at 5.75 2.0) (layer F.Fab))
)