(module GCT_USB1125-GF-B_REVA (layer F.Cu) (tedit 669D9CD8)
  (descr "")
  (fp_text reference REF** (at -3.556 -3.81 0) (layer F.SilkS))
  (fp_text value GCT_USB1125-GF-B_REVA (at 6.985 9.906 0) (layer F.Fab))
  (pad S1 thru_hole oval (at -6.4 0.0) (size 1.108 2.216) (drill oval 0.6 1.6) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S2 thru_hole oval (at 6.4 0.0) (size 1.108 2.216) (drill oval 0.6 1.6) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2 thru_hole circle (at -1.0 -1.2) (size 1.428 1.428) (drill 0.92) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 3 thru_hole circle (at 1.0 -1.2) (size 1.428 1.428) (drill 0.92) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 1 thru_hole rect (at -3.5 -1.2) (size 1.428 1.428) (drill 0.92) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 4 thru_hole circle (at 3.5 -1.2) (size 1.428 1.428) (drill 0.92) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)