(module GCT_BG300-02-X-X-A_REVC (layer F.Cu) (tedit 66ABB30C)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 1.990795 -7.773095 0) (layer F.SilkS))
  (fp_text value GCT_BG300-02-X-X-A_REVC (at 20.30216 7.73318 0) (layer F.Fab))
  (pad 1 smd rect (at -1.27 5.225) (size 1.0 2.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at 1.27 5.225) (size 1.0 2.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)