(module QFN50P300X300X100-17N (layer F.Cu) (tedit 65468CDE)
  (attr smd)
  (fp_text reference REF** (at 0 -2.75) (layer F.SilkS))
  (fp_text value " " (at -0.05 0) (layer F.Fab))
  (pad 5 smd roundrect (at -0.75 1.435 90) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 6 smd roundrect (at -0.25 1.435 90) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 7 smd roundrect (at 0.25 1.435 90) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 8 smd roundrect (at 0.75 1.435 90) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 13 smd roundrect (at 0.75 -1.435 90) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 14 smd roundrect (at 0.25 -1.435 90) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 15 smd roundrect (at -0.25 -1.435 90) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 16 smd roundrect (at -0.75 -1.435 90) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 1 smd roundrect (at -1.435 -0.75) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 2 smd roundrect (at -1.435 -0.25) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 3 smd roundrect (at -1.435 0.25) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 4 smd roundrect (at -1.435 0.75) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 9 smd roundrect (at 1.435 0.75) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 10 smd roundrect (at 1.435 0.25) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 11 smd roundrect (at 1.435 -0.25) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 12 smd roundrect (at 1.435 -0.75) (size 0.86 0.26) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.03)
    (solder_mask_margin 0.102))
  (pad 17 smd rect (at 0 0) (size 1.68 1.68) (layers F.Cu F.Mask)
    (solder_mask_margin 0.102))
  (pad 18 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (pad 19 thru_hole circle (at -0.58 -0.58) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (pad 20 thru_hole circle (at 0.58 -0.58) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (pad 22 thru_hole circle (at 0.58 0.58) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (pad 21 thru_hole circle (at -0.58 0.58) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
)
