(footprint FIL_DLW21SN900SQ2L (layer F.Cu) (tedit 68760FA7)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0.232 -1.6064 0) (layer F.SilkS))
  (fp_text value FIL_DLW21SN900SQ2L (at 5.5152 1.6064 0) (layer F.Fab))
  (pad 1 smd rect (at -0.85 0.4) (size 0.9 0.4) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad 2 smd rect (at 0.85 0.4) (size 0.9 0.4) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad 3 smd rect (at 0.85 -0.4) (size 0.9 0.4) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad 4 smd rect (at -0.85 -0.4) (size 0.9 0.4) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
)