(module FIL_ACT45B-101-2P-TL003 (layer F.Cu) (tedit 66BA1F3B)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -0.635 -3.175 0) (layer F.SilkS))
  (fp_text value FIL_ACT45B-101-2P-TL003 (at 10.795 3.175 0) (layer F.Fab))
  (pad 1 smd rect (at -2.275 -1.25) (size 1.35 0.9) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd rect (at 2.275 -1.25) (size 1.35 0.9) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at -2.275 1.25) (size 1.35 0.9) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd rect (at 2.275 1.25) (size 1.35 0.9) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)