(module "DIP822W55P254L860H461Q6N" (layer F.Cu)
  (descr "DIP-6_2")
  (tags "Integrated Circuit")
  (fp_text reference IC** (at 0 0) (layer F.SilkS))
  (fp_text user %R (at 0 0) (layer F.Fab))
  (fp_text value "DIP822W55P254L860H461Q6N" (at 0 0) (layer F.SilkS) hide)
  (pad 1 thru_hole rect (at -4.108 -2.54) (size 1.15 1.15) (drill 0.75) (layers *.Cu *.Mask))
  (pad 2 thru_hole circle (at -4.108 0) (size 1.15 1.15) (drill 0.75) (layers *.Cu *.Mask))
  (pad 3 thru_hole circle (at -4.108 2.54) (size 1.15 1.15) (drill 0.75) (layers *.Cu *.Mask))
  (pad 4 thru_hole circle (at 4.108 2.54) (size 1.15 1.15) (drill 0.75) (layers *.Cu *.Mask))
  (pad 5 thru_hole circle (at 4.108 0) (size 1.15 1.15) (drill 0.75) (layers *.Cu *.Mask))
  (pad 6 thru_hole circle (at 4.108 -2.54) (size 1.15 1.15) (drill 0.75) (layers *.Cu *.Mask))
  (model H11AA1.stp
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
