(module DIP794W45P254L959H508Q8 (layer F.Cu) (tedit 6720007F)
  (descr "")
  (fp_text reference REF** (at -0.565 -5.607 0) (layer F.SilkS))
  (fp_text value DIP794W45P254L959H508Q8 (at 10.865 5.607 0) (layer F.Fab))
  (pad 1 thru_hole rect (at -3.97 -3.81) (size 1.13 1.13) (drill 0.78) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2 thru_hole circle (at -3.97 -1.27) (size 1.13 1.13) (drill 0.78) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 3 thru_hole circle (at -3.97 1.27) (size 1.13 1.13) (drill 0.78) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 4 thru_hole circle (at -3.97 3.81) (size 1.13 1.13) (drill 0.78) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 5 thru_hole circle (at 3.97 3.81) (size 1.13 1.13) (drill 0.78) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 6 thru_hole circle (at 3.97 1.27) (size 1.13 1.13) (drill 0.78) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 7 thru_hole circle (at 3.97 -1.27) (size 1.13 1.13) (drill 0.78) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 8 thru_hole circle (at 3.97 -3.81) (size 1.13 1.13) (drill 0.78) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)