(module "DIP762W51P254L851H508Q6N" (layer F.Cu)
  (descr "MOC3021M-1")
  (tags "Integrated Circuit")
  (fp_text reference IC** (at 0 0) (layer F.SilkS))
  (fp_text user %R (at 0 0) (layer F.Fab))
  (fp_text value "DIP762W51P254L851H508Q6N" (at 0 0) (layer F.SilkS) hide)
  (pad 1 thru_hole rect (at -3.81 -2.54) (size 1.11 1.11) (drill 0.71) (layers *.Cu *.Mask))
  (pad 2 thru_hole circle (at -3.81 0) (size 1.11 1.11) (drill 0.71) (layers *.Cu *.Mask))
  (pad 3 thru_hole circle (at -3.81 2.54) (size 1.11 1.11) (drill 0.71) (layers *.Cu *.Mask))
  (pad 4 thru_hole circle (at 3.81 2.54) (size 1.11 1.11) (drill 0.71) (layers *.Cu *.Mask))
  (pad 5 thru_hole circle (at 3.81 0) (size 1.11 1.11) (drill 0.71) (layers *.Cu *.Mask))
  (pad 6 thru_hole circle (at 3.81 -2.54) (size 1.11 1.11) (drill 0.71) (layers *.Cu *.Mask))
  (model MOC3021M.stp
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
