(footprint DIP762W45P254L889H508Q6 (layer F.Cu) (tedit 684F87B8)
  (descr "")
  (fp_text reference REF** (at -2.469425 -5.609645 0) (layer F.SilkS))
  (fp_text value DIP762W45P254L889H508Q6 (at 4.748276 5.394818 0) (layer F.Fab))
  (pad 1 thru_hole rect (at -3.81 -2.54) (size 1.13 1.13) (drill 0.73) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2 thru_hole circle (at -3.81 0.0) (size 1.13 1.13) (drill 0.73) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 3 thru_hole circle (at -3.81 2.54) (size 1.13 1.13) (drill 0.73) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 4 thru_hole circle (at 3.81 2.54) (size 1.13 1.13) (drill 0.73) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 5 thru_hole circle (at 3.81 0.0) (size 1.13 1.13) (drill 0.73) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 6 thru_hole circle (at 3.81 -2.54) (size 1.13 1.13) (drill 0.73) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)