(module Package_DIP:DIP-16_W8.89mm_SMDSocket_LongPads (layer F.Cu) (tedit 63EDAB76)
  (descr "16-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads")
  (tags "THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads")
  (attr smd)
  (fp_text reference REF** (at 0 -11.22) (layer F.SilkS))
  (pad 16 smd rect (at 4.445 -8.89) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -4.445 8.89) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 4.445 -6.35) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -4.445 6.35) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 4.445 -3.81) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -4.445 3.81) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 4.445 -1.27) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -4.445 1.27) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 4.445 1.27) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -4.445 -1.27) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 4.445 3.81) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -4.445 -3.81) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 4.445 6.35) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -4.445 -6.35) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 4.445 8.89) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -4.445 -8.89) (size 3.1 1.6) (layers F.Cu F.Paste F.Mask))
  (model ${KISYS3DMOD}/Package_DIP.3dshapes/DIP-16_W8.89mm_SMDSocket.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
